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      Enflexor? TFE System

      Plasma Enhanced Chemical Vapor Deposition System for Thin Film Encapsulation

      Plasma enhanced chemical vapor deposition – thin film encapsulation (PECVD-TFE) system the Enflexor? Gen 6H PECVD deposits superior barrier films to enable flexible organic light-emitting diode (OLED) panel technology.  The Enflexor Gen6H provides a range of buffer films and mask technology with auto mask exchange for all-in-one system process capability.  Yield performance provides a quick path to mass production.  The system easily integrates to other OLED tools.